NANO214 Lithography for Nanofabrication

Department of Science, Technology, Engineering & Mathematics: Nanofabrication Technology

I. Course Number and Title
NANO214 Lithography for Nanofabrication
II. Number of Credits
3 credits
III. Minimum Number of Instructional Minutes Per Semester
lecture 1800 minutes, laboratory 1800 minutes, total 3600 minutes
IV. Prerequisites
Successful completion of the first three semesters of either the NANOFAB Associate degree curriculum or the Certificate curriculum at the Bucks County Community College (BCCC)
NANO211 and NANO212
V. Other Pertinent Information
This course is part of the two new programs of study leading to a Certificate or Degree in NANOFABRICATION TECHNOLOGY. The BCCC has entered into an agreement with PSU (PENN STATE UNIVERSITY) under contract #2067-bccc-cop-2108. Under this contract, the College has developed two new curricula, which will prepare students to attend a group of courses known as the "NANOFABRICATION CAPSTONE SEMESTER COURSES" at the NANOFABRICATION laboratory on the main campus of PSU. This course is one of the six "CAPSTONE COURSES." Although the course will be presented at PSU, it is an integral part of the two new programs of study.
VI. Catalog Course Description
Lithography for NANOFABRICATION: This course covers all aspects of lithography from design and mask fabrication to pattern transfer and inspection. The course is divided into three major sections. The first describes the lithographic process. The second section examines the process from development through inspection. The last section will discuss advanced optical lithographic techniques.
VII. Required Course Content and Direction
  1. Learning Goals:

    1. NANOFABRICATION Industries involve optical, mechanical, biological, chemical, electrical, and combinations of these applications. All share the same equipment, processing, and materials base. A key element used to develop these applications is LITHOGRAPHY. The objective of this course will be to learn the role of LITHOGRAPHY in NANOFABRICATION.
    2. In particular, the emphasis of this course will be on using the NANOFAB laboratory state-of-the-art LITHOGRAPHY equipment.
  2. Planned Sequence of Topics and/or Learning Activities:

    1. Thin film deposition processes
      1. Deposition process overview
      2. Chemical vapor deposition (CVD) processes
        1. Nitride deposition
        2. Oxide deposition
        3. Polysilicon deposition
        4. Plasma enhanced CVD
        5. Physical vapor deposition-sputtering
        6. Physical vapor deposition-thermal and e-gun evaporation
    2. Etching Processes
      1. Wet chemical etching
      2. Plasma etching
      3. Reactive ion etching (RIE)
      4. High ion density reactors
        1. Dielectrics
        2. Polymers
        3. MEMS deep silicon
  3. Assessment Methods for Core Learning Goals:

  4. Reference, Resource, or Learning Materials to be used by Students:

    Criteria for selection of text material. (See course format) Text material should include most, if not all, topics listed above. It is unlikely there is an existing single text that encompasses all these topics. A combination of handouts and on-line resources will be utilized. Material should be reviewed for content and level of presentation.
VIII. Teaching Methods Employed
To be successful in the field of nanofabrication manufacturing technology, students need to develop a strong understanding of the subject matter, develop good laboratory and problem solving skills, be able to work well with others, and present their ideas clearly and concisely. The course is divided into classroom and laboratory activities to achieve these goals. In lecture, students are exposed to relevant theoretical background and are challenged to develop problem-solving skills by utilizing homework assignments that require critical thinking. Students will be required to make class presentations, write reports, and be involved in team problem solving projects. In the laboratory, students will learn operation of equipment used in chemical vapor deposition (CVD) processes, including nitride, oxide and polysilicon deposition. Students will also be familiarized with equipment utilized for plasma enhanced CVD and physical vapor deposition techniques, such as sputtering and thermal and e-gun evaporation. Students will also gain experience with various modes of etching, such as wet chemical etching, plasma etching, and reactive ion etching (RIE). Students continue their nanofabrication project begun in ELEC 212 (Basic Nanofabrication Processes). In this class, students begin the actual fabrication process utilizing knowledge of the various depositions and etching techniques studied in this course. Students are also challenged to reexamine their fabrication plan, developed in ELEC 212, and make modifications to their plan based both upon new knowledge gained in this course, as well as upon the results of carrying out the initial steps of their procedure.

Review/Approval Date - 3/02